{"product_id":"3d-ic-integration-and-packaging-john-lau-9780071848060","title":"3D IC Integration and Packaging","description":"\u003cp\u003e\u003cb\u003ePublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product\u003c\/b\u003e.\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cbr\u003e\u003cb\u003e\u003cb\u003e\u003cbr\u003e\u003c\/b\u003e\u003cbr\u003eA comprehensive guide to 3D IC integration and packaging technology\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003e\u003ci\u003e3D IC Integration and Packaging\u003c\/i\u003e fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003ci\u003e3D IC Integration and Packaging \u003c\/i\u003ecovers: \u003cbr\u003e\u003cbr\u003e\u003cbr\u003e- 3D integration for semiconductor IC packaging\u003cbr\u003e- Through-silicon vias modeling and testing\u003cbr\u003e- Stress sensors for thin-wafer handling and strength measurement\u003cbr\u003e- Package substrate technologies\u003cbr\u003e- Microbump fabrication, assembly, and reliability\u003cbr\u003e- 3D Si integration\u003cbr\u003e- 2.5D\/3D IC integration\u003cbr\u003e- 3D IC integration with passive interposer\u003cbr\u003e- Thermal management of 2.5D\/3D IC integration\u003cbr\u003e- Embedded 3D hybrid integration\u003cbr\u003e- 3D LED and IC integration\u003cbr\u003e- 3D MEMS and IC integration\u003cbr\u003e- 3D CMOS image sensors and IC integration\u003cbr\u003e- PoP, chip-to-chip interconnects, and embedded fan-out WLP\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e John H. Lau\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 0071848061\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9780071848060\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e McGraw-Hill Companies\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 08\/27\/2015\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 480\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 2.24lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.30h x 7.50w x 1.20d","brand":"John H. Lau","offers":[{"title":"Hardcover","offer_id":43946200563967,"sku":"9780071848060","price":218.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/products\/img_7cf9d92d-21df-41ac-b4d7-31b7ae4348ee.jpg?v=1681512002","url":"https:\/\/www.whiterainbookhouse.com\/products\/3d-ic-integration-and-packaging-john-lau-9780071848060","provider":"WR Book House","version":"1.0","type":"link"}