{"product_id":"3d-ic-stacking-technology-banqiu-wu-9780071741958","title":"3D IC Stacking Technology","description":"Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.\u003cbr\u003eThe latest advances in three-dimensional integrated circuit stacking technology\u003cp\u003eWith a focus on industrial applications, \u003ci\u003e3D IC Stacking Technology\u003c\/i\u003e offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.\u003c\/p\u003e\u003cp\u003e\u003ci\u003e3D IC Stacking Technology\u003c\/i\u003e covers: \u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eHigh density through silicon stacking (TSS) technology\u003c\/li\u003e\n\u003cli\u003ePractical design ecosystem for heterogeneous 3D IC products\u003c\/li\u003e\n\u003cli\u003eDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack\u003c\/li\u003e\n\u003cli\u003eProcess integration for TSV manufacturing\u003c\/li\u003e\n\u003cli\u003eHigh-aspect-ratio silicon etch for TSV\u003c\/li\u003e\n\u003cli\u003eDielectric deposition for TSV\u003c\/li\u003e\n\u003cli\u003eBarrier and seed deposition\u003c\/li\u003e\n\u003cli\u003eCopper electrodeposition for TSV\u003c\/li\u003e\n\u003cli\u003eChemical mechanical polishing for TSV applications\u003c\/li\u003e\n\u003cli\u003eTemporary and permanent bonding\u003c\/li\u003e\n\u003cli\u003eAssembly and test aspects of TSV technology\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Banqiu Wu, Ajay Kumar, Sesh Ramaswami\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 007174195X\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9780071741958\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e McGraw-Hill Companies\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 07\/28\/2011\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 544\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.70lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.00h x 5.90w x 0.90d\u003cbr\u003e\u003cbr\u003e\u003cb\u003eReview Citation(s): \u003c\/b\u003e\u003cbr\u003e\u003ci\u003eReference and Research Bk News\u003c\/i\u003e 10\/01\/2011 pg. 292","brand":"Banqiu Wu","offers":[{"title":"Hardcover","offer_id":44054814425343,"sku":"9780071741958","price":164.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_23e2d488-c16d-4c54-b647-6c13522e5e29.jpg?v=1685032153","url":"https:\/\/www.whiterainbookhouse.com\/products\/3d-ic-stacking-technology-banqiu-wu-9780071741958","provider":"WR Book House","version":"1.0","type":"link"}