{"product_id":"advanced-wirebond-interconnection-technology-shankara-k-prasad-9781402077623","title":"Advanced Wirebond Interconnection Technology","description":"\u003cb\u003eAdvanced Wire Bond Interconnection Technology\u003c\/b\u003e addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Shankara K. Prasad\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 1402077629\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9781402077623\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Springer\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 04\/30\/2004\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 669\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 2.47lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.04h x 6.66w x 1.51d","brand":"Shankara K. Prasad","offers":[{"title":"Hardcover","offer_id":46670423064831,"sku":"9781402077623","price":329.99,"currency_code":"USD","in_stock":true}],"url":"https:\/\/www.whiterainbookhouse.com\/products\/advanced-wirebond-interconnection-technology-shankara-k-prasad-9781402077623","provider":"WR Book House","version":"1.0","type":"link"}