{"product_id":"advances-in-chemical-mechanical-planarization-babu-suryadevara-9780081001653","title":"Advances in Chemical Mechanical Planarization (Cmp)","description":"\u003cp\u003e\u003ci\u003eAdvances in Chemical Mechanical Planarization (CMP) \u003c\/i\u003eprovides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. \u003c\/p\u003e \u003cp\u003eThis important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. \u003c\/p\u003e \u003cp\u003ePart Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction.\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Babu Suryadevara\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 0081001657\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9780081001653\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Woodhead Publishing\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 01\/08\/2016\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 536\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 2.15lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.20h x 6.10w x 1.20d","brand":"Babu Suryadevara","offers":[{"title":"Hardcover","offer_id":48013697941759,"sku":"9780081001653","price":285.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_9b1e71fc-8bd7-4aed-a9e2-f621b7b21cb8.jpg?v=1767744209","url":"https:\/\/www.whiterainbookhouse.com\/products\/advances-in-chemical-mechanical-planarization-babu-suryadevara-9780081001653","provider":"WR Book House","version":"1.0","type":"link"}