{"product_id":"antenna-in-package-technology-and-applications-duixian-liu-9781119556633","title":"Antenna-In-Package Technology and Applications","description":"\u003cp\u003e\u003cb\u003eA comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003ci\u003eAntenna-in-Package Technology and Applications\u003c\/i\u003e contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors--well-known experts on the topic--explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging-based AiP, and 3D-printing-based AiP. \u003cbr\u003e \u003cbr\u003e The book includes a detailed discussion of the surface laminar circuit-based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: \u003c\/p\u003e \u003cp\u003e- Includes a brief history of antenna-in-package technology \u003cbr\u003e - Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) \u003cbr\u003e - Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance\u003c\/p\u003e \u003cp\u003eWritten for students in electrical engineering, professors, researchers, and RF engineers, \u003ci\u003eAntenna-in-Package Technology and Applications\u003c\/i\u003e offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Duixian Liu,Yueping Zhang\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 1119556635\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9781119556633\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Wiley-IEEE Press\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 03\/31\/2020\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 416\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.65lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.10h x 6.00w x 0.90d","brand":"Duixian Liu","offers":[{"title":"Hardcover","offer_id":48013888454911,"sku":"9781119556633","price":140.95,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_5aa76c50-03f5-4a9b-8e8a-cbc961ca7952.jpg?v=1767745391","url":"https:\/\/www.whiterainbookhouse.com\/products\/antenna-in-package-technology-and-applications-duixian-liu-9781119556633","provider":"WR Book House","version":"1.0","type":"link"}