{"product_id":"cu-interconnects-glass-and-ai-assisted-simulation-john-lau-9789819568901","title":"Cu-Interconnects, Glass, and Ai-Assisted Simulation for Chiplets and Heterogeneous Integration","description":"\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e John Lau,Kuo-Ning Chiang\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 9819568900\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9789819568901\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Springer\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 06\/01\/2026\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 547\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 2.14lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.21h x 6.14w x 1.25d","brand":"John Lau","offers":[{"title":"Hardcover","offer_id":48659705004287,"sku":"9789819568901","price":219.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_38a03f11-e3ac-4dd2-8d22-2d89ce273bd2.jpg?v=1781202883","url":"https:\/\/www.whiterainbookhouse.com\/products\/cu-interconnects-glass-and-ai-assisted-simulation-john-lau-9789819568901","provider":"WR Book House","version":"1.0","type":"link"}