{"product_id":"die-attach-materials-for-high-temperature-kim-s-siow-9783319992556","title":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability","description":"\u003cp\u003eComprehensively addresses both sintering and soldering, thereby comprehensively addressing principles, methods, and performance of high-temperature die-attach materials\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eEmphasizes the industrial perspective with chapters writen by engineers who have hands-on experience using these technologies; Infineon Technologies, Bosch, ON Semiconductor, and Hughes Baker are represented as well as materials and equipment suppliers such as as Indium and Boschman \u0026amp; Locatelli\u003c\/p\u003e\u003cp\u003eSimultaneously provides the detailed science underlying these technologies by leading academic researchers in the field\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Kim S. Siow\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 3319992554\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9783319992556\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Springer\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 02\/07\/2019\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 279\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.33lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.21h x 6.14w x 0.69d","brand":"Kim S. Siow","offers":[{"title":"Hardcover","offer_id":43940790763775,"sku":"9783319992556","price":199.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/products\/img_e56a0fbd-7109-4a64-a35b-ae82dc79be90.jpg?v=1681449198","url":"https:\/\/www.whiterainbookhouse.com\/products\/die-attach-materials-for-high-temperature-kim-s-siow-9783319992556","provider":"WR Book House","version":"1.0","type":"link"}