{"product_id":"electrical-design-of-through-silicon-manho-lee-9789401779494","title":"Electrical Design of Through Silicon Via","description":"\u003cp\u003eThrough Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Manho Lee\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 940177949X\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9789401779494\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Springer\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 09\/27\/2016\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 280\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Paperback\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 0.91lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.21h x 6.14w x 0.61d","brand":"Manho Lee","offers":[{"title":"Paperback","offer_id":46401441005823,"sku":"9789401779494","price":109.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_686110f2-30aa-4df1-850c-7a4298451e44.jpg?v=1733887561","url":"https:\/\/www.whiterainbookhouse.com\/products\/electrical-design-of-through-silicon-manho-lee-9789401779494","provider":"WR Book House","version":"1.0","type":"link"}