{"product_id":"electronic-components-failure-analysis-tsai-feng-sung-9786260154189","title":"Electronic Components Failure Analysis: Methods and Experience for Beginners","description":"\u003cp\u003e\u003cstrong\u003eElectronic Components Failure Analysis for Beginners: Methods and Experience\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eA Practical Guide to Instrument-Based Failure Diagnosis for Beginners\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eThis book provides practical experience in electronic factories for students majoring in electronics, beginners in electronics, and professionals in the electronics industry. It covers topics not taught in schools and introduces the causes of electronic component failure analysis.\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eThe colorful graphic analysis report allows you to absorb the author's years of experience. Beginners can learn a lifetime's worth of analysis tools in one go and quickly accumulate a year's worth of expertise.\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eContent includes: \u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eBGA analysis\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eDYE and PRY test\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003e2D\/3D X-ray analysis\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eSilver migration analysis\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eEDX energy dispersive spectroscopy reports\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eSulfurization test, Flux, foreign matter intrusion, salination, and carbon deposit analysis\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eSoldering ability test\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eFTIR Fourier transform infrared spectrometer reports\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eXRF fluorescent X-ray hazardous substance analyzer reports\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eLED popcorn stress failure\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eElectrostatic damage\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eC-SAM ultrasonic inspection\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eAnd various component failure analysis reports.\u003c\/strong\u003e\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Tsai Feng Sung\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 6260154186\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9786260154189\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Sung Tsai Feng Isbn: 978-626-01-5418-9\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 12\/12\/2025\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 92\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Paperback\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 0.70lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 11.69h x 8.27w x 0.25d","brand":"Tsai Feng Sung","offers":[{"title":"Paperback","offer_id":48437619261695,"sku":"9786260154189","price":69.9,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_a9eed5e5-deff-4775-b443-23b59b072fa5.jpg?v=1777162944","url":"https:\/\/www.whiterainbookhouse.com\/products\/electronic-components-failure-analysis-tsai-feng-sung-9786260154189","provider":"WR Book House","version":"1.0","type":"link"}