{"product_id":"electronic-packaging-for-high-reliability-r-r-tummala-9780792352181","title":"Electronic Packaging for High Reliability, Low Cost Electronics","description":"Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e R. R. Tummala\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 0792352181\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9780792352181\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Springer\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 02\/29\/2000\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 296\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.35lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.21h x 6.14w x 0.75d","brand":"R. R. Tummala","offers":[{"title":"Hardcover","offer_id":47422675484927,"sku":"9780792352181","price":169.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_b080e8b2-28c4-4195-82e5-89f511bde1b4.jpg?v=1761527899","url":"https:\/\/www.whiterainbookhouse.com\/products\/electronic-packaging-for-high-reliability-r-r-tummala-9780792352181","provider":"WR Book House","version":"1.0","type":"link"}