{"product_id":"fan-out-wafer-level-packaging-john-h-lau-9789811088834","title":"Fan-Out Wafer-Level Packaging","description":"Patent Issues of Fan-out Wafer-Level Packaging.- Flip Chip Technology vs. FOWLP.- Fan-In Wafer-Level Packaging vs. FOWLP.- Embedded Chip Packaging.- FOWLP: Chip-First and Die Face-Down.- FOWLP: Chip-First and Die Face-Up.- FOWLP: Chip-Last or RDL-First.- FOWLP: PoP with FOWLP.- Fan-Out Panel-Level Packaging (FOPLP).- 3D Integration.- Heterogeneous Integration.\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e John H. Lau\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 9811088837\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9789811088834\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Springer\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 04\/13\/2018\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 303\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.39lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.21h x 6.14w x 0.75d","brand":"John H. Lau","offers":[{"title":"Hardcover","offer_id":43983546351871,"sku":"9789811088834","price":159.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_8ddffb0d-494b-4ce9-98e0-a0acffbe8207.jpg?v=1683267293","url":"https:\/\/www.whiterainbookhouse.com\/products\/fan-out-wafer-level-packaging-john-h-lau-9789811088834","provider":"WR Book House","version":"1.0","type":"link"}