{"product_id":"foldable-flex-and-thinned-silicon-john-w-balde-9780792376767","title":"Foldable Flex and Thinned Silicon Multichip Packaging Technology","description":"\u003cp\u003e\u003cstrong\u003eFoldable Flex and Thinned Silicon Multichip Packaging Technology\u003c\/strong\u003e presents newly emerging methods used to make stacked chip packages in the so-called 2-1\/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. \u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e John W. Balde\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 0792376765\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9780792376767\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Springer\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 01\/31\/2003\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 347\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.64lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.52h x 6.40w x 1.02d","brand":"John W. Balde","offers":[{"title":"Hardcover","offer_id":47422701043967,"sku":"9780792376767","price":169.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_8adc82d9-05f8-4034-bc73-f501b17b7ee3.jpg?v=1761527922","url":"https:\/\/www.whiterainbookhouse.com\/products\/foldable-flex-and-thinned-silicon-john-w-balde-9780792376767","provider":"WR Book House","version":"1.0","type":"link"}