{"product_id":"heterogeneous-integrations-john-h-lau-9789811372230","title":"Heterogeneous Integrations","description":"\u003cp\u003eChapter 1. Overview of 3D IC Heterogeneous Integrations.- Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates.- Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers).- Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges).- Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates.- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking.- Chapter 7. 3D IC Heterogeneous Integration in PoP Formats.- Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats.- Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL.- Chapter 10. Future Trends of 3D IC Heterogeneous Integrations.\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e John H. Lau\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 9811372233\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9789811372230\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Springer\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 04\/12\/2019\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 368\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.59lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.21h x 6.14w x 0.88d","brand":"John H. Lau","offers":[{"title":"Hardcover","offer_id":43941388648703,"sku":"9789811372230","price":169.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/products\/img_f7656fb0-3428-4700-b58d-cbda486795f9.jpg?v=1681452637","url":"https:\/\/www.whiterainbookhouse.com\/products\/heterogeneous-integrations-john-h-lau-9789811372230","provider":"WR Book House","version":"1.0","type":"link"}