{"product_id":"hybrid-assemblies-and-multichip-modules-fred-w-kear-9780824784669","title":"Hybrid Assemblies and Multichip Modules","description":"Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Fred W. Kear\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 0824784669\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9780824784669\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e CRC Press\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 12\/16\/1992\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 296\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.41lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.22h x 6.42w x 0.97d","brand":"Fred W. Kear","offers":[{"title":"Hardcover","offer_id":48449005191423,"sku":"9780824784669","price":225.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_b8b0e0dd-7024-4934-8057-b5e24fac88dc.jpg?v=1777261527","url":"https:\/\/www.whiterainbookhouse.com\/products\/hybrid-assemblies-and-multichip-modules-fred-w-kear-9780824784669","provider":"WR Book House","version":"1.0","type":"link"}