{"product_id":"modeling-analysis-design-and-tests-hengyun-zhang-9780081025321","title":"Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore","description":"\u003cp\u003e\u003ci\u003eModeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore\u003c\/i\u003e provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D\/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Hengyun Zhang,Faxing Che,Tingyu Lin\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 0081025327\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9780081025321\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Woodhead Publishing\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 11\/15\/2019\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 434\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Paperback\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.28lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.00h x 6.00w x 0.89d","brand":"Hengyun Zhang","offers":[{"title":"Paperback","offer_id":48013701251327,"sku":"9780081025321","price":235.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_ece3dc95-7b65-4b61-a14c-0eb3a1ec4bc9.jpg?v=1767744229","url":"https:\/\/www.whiterainbookhouse.com\/products\/modeling-analysis-design-and-tests-hengyun-zhang-9780081025321","provider":"WR Book House","version":"1.0","type":"link"}