{"product_id":"nanoparticle-engineering-for-chemical-mechanical-planarization-ungyu-paik-9781420059113","title":"Nanoparticle Engineering for Chemical-Mechanical Planarization: Fabrication of Next-Generation Nanodevices","description":"\u003cp\u003eIn the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices.\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eNanoparticle Engineering for Chemical-Mechanical Planarization\u003c\/strong\u003e explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology.\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003eMost books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Ungyu Paik, Jea-Gun Park\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 1420059114\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9781420059113\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e CRC Press\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 02\/20\/2009\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 224\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.10lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.30h x 6.10w x 0.80d\u003cbr\u003e\u003cbr\u003e\u003cb\u003eReview Citation(s): \u003c\/b\u003e\u003cbr\u003e\u003ci\u003eScitech Book News\u003c\/i\u003e 06\/01\/2009 pg. 161","brand":"Ungyu Paik","offers":[{"title":"Hardcover","offer_id":43934772756735,"sku":"9781420059113","price":230.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/products\/img_09ac1b93-0c34-4578-badb-529afbf5996e.jpg?v=1681415962","url":"https:\/\/www.whiterainbookhouse.com\/products\/nanoparticle-engineering-for-chemical-mechanical-planarization-ungyu-paik-9781420059113","provider":"WR Book House","version":"1.0","type":"link"}