{"product_id":"power-thermal-noise-and-signal-yue-ma-9780367023430","title":"Power, Thermal, Noise, and Signal Integrity Issues on Substrate\/Interconnects Entanglement","description":"\u003cp\u003eAs demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D\/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Yue Ma, Christian Gontrand\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 0367023431\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9780367023430\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e CRC Press\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 03\/28\/2019\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 226\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover","brand":"Yue Ma","offers":[{"title":"Hardcover","offer_id":43919586230527,"sku":"9780367023430","price":150.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/products\/img_e4529c80-3e91-49c0-980d-78cbd79006e9.jpg?v=1680810217","url":"https:\/\/www.whiterainbookhouse.com\/products\/power-thermal-noise-and-signal-yue-ma-9780367023430","provider":"WR Book House","version":"1.0","type":"link"}