{"product_id":"reliability-of-rohs-compliant-2d-and-john-h-lau-9780071753791","title":"Reliability of RoHS-Compliant 2D and 3D IC Interconnects","description":"Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.\u003cbr\u003eProven 2D and 3D IC lead-free interconnect reliability techniques\u003cp\u003e\u003ci\u003eReliability of RoHS-Compliant 2D and 3D IC Interconnects\u003c\/i\u003e offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.\u003c\/p\u003e\u003cp\u003eCovers reliability of: \u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e2D and 3D IC lead-free interconnects\u003c\/li\u003e\n\u003cli\u003eCCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints\u003c\/li\u003e\n\u003cli\u003eLead-free (SACX) solder joints\u003c\/li\u003e\n\u003cli\u003eLow-temperature lead-free (SnBiAg) solder joints\u003c\/li\u003e\n\u003cli\u003eSolder joints with voids, high strain rate, and high ramp rate\u003c\/li\u003e\n\u003cli\u003eVCSEL and LED lead-free interconnects\u003c\/li\u003e\n\u003cli\u003e3D LED and 3D MEMS with TSVs\u003c\/li\u003e\n\u003cli\u003eChip-to-wafer (C2W) bonding and lead-free interconnects\u003c\/li\u003e\n\u003cli\u003eWafer-to-wafer (W2W) bonding and lead-free interconnects\u003c\/li\u003e\n\u003cli\u003e3D IC chip stacking with low-temperature bonding\u003c\/li\u003e\n\u003cli\u003eTSV interposers and lead-free interconnects\u003c\/li\u003e\n\u003cli\u003eElectromigration of lead-free microbumps for 3D IC integration\u003c\/li\u003e\n\u003c\/ul\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e John H. Lau\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 0071753796\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9780071753791\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e McGraw-Hill Companies\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 12\/22\/2010\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 640\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 2.00lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.10h x 6.20w x 0.90d\u003cbr\u003e\u003cbr\u003e\u003cb\u003eReview Citation(s): \u003c\/b\u003e\u003cbr\u003e\u003ci\u003eReference and Research Bk News\u003c\/i\u003e 02\/01\/2011 pg. 339","brand":"John H. Lau","offers":[{"title":"Hardcover","offer_id":46250432364799,"sku":"9780071753791","price":146.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_d96198b3-34e3-4aa7-a9f1-ee940562d683.jpg?v=1729600304","url":"https:\/\/www.whiterainbookhouse.com\/products\/reliability-of-rohs-compliant-2d-and-john-h-lau-9780071753791","provider":"WR Book House","version":"1.0","type":"link"}