{"product_id":"semiconductor-advanced-packaging-john-h-lau-9789811613753","title":"Semiconductor Advanced Packaging","description":"Recent Advance on Semiconductor Packaging.- System-in-Package.- Fan-In Wafer\/Panel-Level Chip-Scale Packages.- Fan-Out Wafer\/Panel-Level Packaging.- 2D, 2.1D, and 2.3D IC Integration.- 2.5D IC Integration.- 3D IC Integration.- Hybrid Bonding.- Chiplets Packaging.- Dielectric Materials.- Trends and Roadmap for Advanced Semiconductor Packaging.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e John H. Lau\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 9811613753\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9789811613753\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Springer\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 05\/18\/2021\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 498\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.99lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.21h x 6.14w x 1.13d","brand":"John H. Lau","offers":[{"title":"Hardcover","offer_id":43988459913471,"sku":"9789811613753","price":179.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_4e8965e0-26d4-49fd-b28c-dbb71efb492a.jpg?v=1683294604","url":"https:\/\/www.whiterainbookhouse.com\/products\/semiconductor-advanced-packaging-john-h-lau-9789811613753","provider":"WR Book House","version":"1.0","type":"link"}