{"product_id":"silicon-microchannel-heat-sinks-lian-zhang-9783540401810","title":"Silicon Microchannel Heat Sinks: Theories and Phenomena","description":"There is significant current interest in new technologies for IC (Integrated Circuit) cooling, driven by the rapid increase in power densities in ICs and the trend towards high-density electronic packaging for applications throughout civilian and military markets. In accordance with Moore's Law, the number of transistors on 6 Intel Pentium microprocessors has increased from 7.5 x10 in 1997 (Pentium II) to 6 55 x10 in 2002 (Pentium 4). Considering the rapid increase in the integration density, thermal management must be well designed to ensure proper functionality of these high-speed, high-power chips. Forced air convection has been traditionally used to remove the heat through a finned heat sink and fan module. 2 Currently, with 82 W power dissipation rate, approximately 62 W\/cm heat flux, from a Pentium 4 processor with 3.06 GHz core frequency, the noise generated from high rotating speed fans is approaching the limit of acceptable level for humans. However, the power dissipation from a single cost-performance chip is 2 expected to exceed 100 W\/cm by the year 2005, when the air cooling has to be replaced by new cooling technologies. Among alternative cooling methods, the two-phase microchannel heat sink is one of the most promising solutions. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of such a device.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 3540401814\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9783540401810\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Springer\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 11\/26\/2003\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 141\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 0.79lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.20h x 6.30w x 0.60d","brand":"Lian Zhang","offers":[{"title":"Hardcover","offer_id":44245344944383,"sku":"9783540401810","price":109.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_90ffcf79-abb0-4e49-8b8c-98be319cef3a.jpg?v=1693927517","url":"https:\/\/www.whiterainbookhouse.com\/products\/silicon-microchannel-heat-sinks-lian-zhang-9783540401810","provider":"WR Book House","version":"1.0","type":"link"}