{"product_id":"through-silicon-vias-for-3d-integration-john-lau-9780071785143","title":"Through-Silicon Vias for 3D Integration","description":"Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.\u003cbr\u003eA comprehensive guide to TSV and other enabling technologies for 3D integration\u003cp\u003eWritten by an expert with more than 30 years of experience in the electronics industry, \u003ci\u003eThrough-Silicon Vias for 3D Integration\u003c\/i\u003e provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.\u003c\/p\u003e\u003cp\u003eThis book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.\u003c\/p\u003e\u003cp\u003eCoverage includes: \u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eNanotechnology and 3D integration for the semiconductor industry\u003c\/li\u003e\n\u003cli\u003eTSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing\u003c\/li\u003e\n\u003cli\u003eTSVs: mechanical, thermal, and electrical behaviors\u003c\/li\u003e\n\u003cli\u003eThin-wafer strength measurement\u003c\/li\u003e\n\u003cli\u003eWafer thinning and thin-wafer handling\u003c\/li\u003e\n\u003cli\u003eMicrobumping, assembly, and reliability\u003c\/li\u003e\n\u003cli\u003eMicrobump electromigration\u003c\/li\u003e\n\u003cli\u003eTransient liquid-phase bonding: C2C, C2W, and W2W\u003c\/li\u003e\n\u003cli\u003e2.5D IC integration with interposers\u003c\/li\u003e\n\u003cli\u003e3D IC integration with interposers\u003c\/li\u003e\n\u003cli\u003eThermal management of 3D IC integration\u003c\/li\u003e\n\u003cli\u003e3D IC packaging\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e John H. Lau\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 0071785140\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9780071785143\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e McGraw-Hill Companies\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 10\/11\/2012\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 512\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.50lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.30h x 6.00w x 0.80d","brand":"John H. Lau","offers":[{"title":"Hardcover","offer_id":44056616337663,"sku":"9780071785143","price":179.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_276099df-a36e-4ff3-a1de-018654aefd43.jpg?v=1685042304","url":"https:\/\/www.whiterainbookhouse.com\/products\/through-silicon-vias-for-3d-integration-john-lau-9780071785143","provider":"WR Book House","version":"1.0","type":"link"}