{"product_id":"tribology-in-chemical-mechanical-planarization-hong-liang-9780367393250","title":"Tribology In Chemical-Mechanical Planarization","description":"Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Hong Liang,David Craven\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 0367393255\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9780367393250\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e CRC Press\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 09\/19\/2019\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 200\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Paperback\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 0.40lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.10h x 6.10w x 0.50d","brand":"Hong Liang","offers":[{"title":"Paperback","offer_id":48443379089663,"sku":"9780367393250","price":94.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_ab03025e-4695-4ca3-8300-5e21ebadd265.jpg?v=1777205125","url":"https:\/\/www.whiterainbookhouse.com\/products\/tribology-in-chemical-mechanical-planarization-hong-liang-9780367393250","provider":"WR Book House","version":"1.0","type":"link"}