{"product_id":"tsv-3d-rf-integration-shenglin-ma-9780323996020","title":"Tsv 3D RF Integration: High Resistivity Si Interposer Technology","description":"\u003cp\u003e\u003ci\u003eTSV 3D RF Integration: High Resistivity Si Interposer Technology\u003c\/i\u003e systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. \u003c\/p\u003e \u003cp\u003eA series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. \u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Shenglin Ma, Yufeng Jin\u003cbr\u003e\u003cb\u003eISBN-10:\u003c\/b\u003e 0323996027\u003cbr\u003e\u003cb\u003eISBN-13:\u003c\/b\u003e 9780323996020\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Elsevier\u003cbr\u003e\u003cb\u003eLanguage:\u003c\/b\u003e English\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 04\/27\/2022\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 292\u003cbr\u003e\u003cb\u003eFormat:\u003c\/b\u003e Paperback\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.11lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.25h x 7.50w x 0.61d","brand":"Shenglin Ma","offers":[{"title":"Paperback","offer_id":44056482971903,"sku":"9780323996020","price":250.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0662\/2982\/9887\/files\/img_70f27d96-5a91-4617-ba40-a3e0d76a1d09.jpg?v=1685041560","url":"https:\/\/www.whiterainbookhouse.com\/products\/tsv-3d-rf-integration-shenglin-ma-9780323996020","provider":"WR Book House","version":"1.0","type":"link"}