3D IC Integration and Packaging by Lau, John

3D IC Integration and Packaging (Hardcover) (ISBN-13: 9780071848060)

Vendor: John H. Lau
Product type: Books
Format: Hardcover
$218.00
$218.00
$218.00
Subtotal: $218.00
3D IC Integration and Packaging by Lau, John

3D IC Integration and Packaging

$218.00

3D IC Integration and Packaging

$218.00
Format: Hardcover

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