Advances in Thermal Modeling of Electronic Components and Systems, Volume 2 (Hardcover) (ISBN-13: 9780791800157)

The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.

Author: Avram Bar-Cohen
ISBN-10: 0791800156
ISBN-13: 9780791800157
Publisher: American Society of Mechanical Engineers
Language: English
Published: 01/01/1990
Pages: 437
Format: Hardcover
Weight: 1.70lbs
Size: 9.10h x 6.10w x 1.10d