Area Array Package Design (Paperback) (ISBN-13: 9780071737739)

This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.

Author: Ken Gilleo
ISBN-10: 0071737731
ISBN-13: 9780071737739
Publisher: McGraw-Hill
Language: English
Published: 10/24/2003
Pages: 220
Format: Paperback
Weight: 0.85lbs
Size: 9.25h x 7.50w x 0.46d