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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices (Paperback) (ISBN-13: 9780367635886)
Vendor:
Ephraim Suhir
Product type:
Books
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Description
xThe book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
Author: Ephraim Suhir
ISBN-10: 0367635887
ISBN-13: 9780367635886
Publisher: CRC Press
Language: English
Published: 10/04/2024
Pages: 382
Format: Paperback
Weight: 1.25lbs
Size: 9.21h x 6.14w x 0.84d
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