Blockchain for 5g-Enabled Iot: The New Wave for Industrial Automation (Paperback) (ISBN-13: 9783030674922)

Sudeep Tanwar is an associate professor in the Computer Science and Engineering Department at the Institute of Technology, Nirma University, Ahmedabad, Gujarat, India. He is visiting Professor in Jan Wyzykowski University in Polkowice, Poland, and University of Pitesti in Pitesti, Romania. He received his B.Tech in 2002 from Kurukshetra University, India, M.Tech (Honors) in 2009 from Guru Gobind Singh Indraprastha University, Delhi, India, and Ph.D. in 2016 with specialization in Wireless Sensor Network. He has authored or coauthored more than 200 technical research papers published in leading journals and conferences from the IEEE, Elsevier, Springer, Wiley, etc. Some of his research findings are published in top-cited journals such as IEEE TNSE, IEEE TVT, IEEE TII, Transactions on Emerging, Telecommunications Technologies, IEEE WCM, IEEE Networks, IEEE Systems Journal, IEEE Access, IET Software, IET Networks, JISA, Computer Communication, Applied Soft Computing, JPDC, JNCA, PMC, SUSCOM, CEE, IJCS, Software: Practice and Experience, MTAP, and Telecommunication System. He has also edited/authored 13 books with national/international publishers like IET and Springer. One of his edited textbooks, Multimedia Big Data Computing for IoT Applications: Concepts, Paradigms, and Solutions, published by Springer in 2019 has been downloaded 3.7 million times until March 13, 2021. This text book attracts attention of researchers across the globe. (https: //link.springer.com/book/10.1007/978-981-13-8759-3). He has guided many students leading to M.E./M.Tech and Ph.D. He is currently serving the editorial boards of Physical Communication, Computer Communications, International Journal of Communication System, and Security and Privacy. His current interest includes wireless sensor networks, fog computing, smart grid, IoT, and blockchain technology. He initiated the research field of blockchain technology adoption in various verticals in 2017. He was invited as guest editor/editorial board member of many international journals, as keynote speaker at many international conferences held in Asia and as program chair, publications chair, publicity chair, and session chair at many international conferences held in North America, Europe, Asia, and Africa. He has been awarded best research paper awards from IEEE GLOBECOM 2018, IEEE ICC 2019, and Springer ICRIC-2019. He is a Senior Member of IEEE, CSI, IAENG, ISTE, CSTA, and the member of Technical Committee on Tactile Internet of IEEE Communication Society.