Cu Organocopper Compounds: Index Empirical Formula Index and Ligand Formula Index for Parts 1 to 4 by Füssel, Johannes

Cu Organocopper Compounds: Index Empirical Formula Index and Ligand Formula Index for Parts 1 to 4 (Paperback) (ISBN-13: 9783662116630)

Vendor: Johannes Füssel
Product type: Books
Format: Paperback
$54.99
$54.99
$54.99
Subtotal: $54.99
Cu Organocopper Compounds: Index Empirical Formula Index and Ligand Formula Index for Parts 1 to 4 by Füssel, Johannes

Cu Organocopper Compounds: Index Empirical Formula Index and Ligand Formula Index for Parts 1 to 4

$54.99
Cu Organocopper Compounds: Index Empirical Formula Index and Ligand Formula Index for Parts 1 to 4 by Füssel, Johannes

Cu Organocopper Compounds: Index Empirical Formula Index and Ligand Formula Index for Parts 1 to 4

$54.99
Format: Paperback
Description
Description
x
Organocopper reagents have found wide use in synthetic organic chemistry during the past few decades. Structural elucidation has not yet received much attention in organocopper chemistry and the aggregation of most products is unknown. This last volume brings to an end the series of organocopper compounds and contains an Empirical Formula and Ligand Formula Index for about 3000 organocopper compounds and reagents described in Parts 1 to 4.

Author: Johannes Füssel
ISBN-10: 3662116634
ISBN-13: 9783662116630
Publisher: Springer
Language: English
Published: 10/03/2013
Pages: 244
Format: Paperback
Weight: 0.99lbs
Size: 10.00h x 7.00w x 0.54d

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