Development of a Fixed Abrasive Slicing Technique for Reducing Cost of Photovoltaic Wafers by

Development of a Fixed Abrasive Slicing Technique for Reducing Cost of Photovoltaic Wafers (Paperback) (ISBN-13: 9781249201229)

Vendor: WR Book House
Product type: Books
Format: Paperback
$17.75
$17.75
$17.75
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Development of a Fixed Abrasive Slicing Technique for Reducing Cost of Photovoltaic Wafers by

Development of a Fixed Abrasive Slicing Technique for Reducing Cost of Photovoltaic Wafers

$17.75
Development of a Fixed Abrasive Slicing Technique for Reducing Cost of Photovoltaic Wafers by

Development of a Fixed Abrasive Slicing Technique for Reducing Cost of Photovoltaic Wafers

$17.75
Format: Paperback
Description
Description
x
This report examines a wafer slicing technique developed by Crystal Systems, Inc. that reduces the cost of photovoltaic wafers. This fixed, abrasive slicing technique (FAST) uses a multiwire bladepack and a diamond-plated wirepack; water is the coolant. FAST is in the prototype production stage and reduces expendable material costs while retaining the advantages of a multiwire slurry technique. The cost analysis revealed that costs can be decreased by making more cuts per bladepack and slicing more wafers per linear inch. Researchers studied the degradation of bladepacks and increased wirepack life.

ISBN-10: 1249201225
ISBN-13: 9781249201229
Publisher: Bibliogov
Language: English
Published: 07/01/2012
Pages: 68
Format: Paperback
Weight: 0.31lbs
Size: 9.69h x 7.44w x 0.14d

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