Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability (Hardcover) (ISBN-13: 9783319992556)

Kim S. Siow is a Research Fellow at the Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia. Before joining IMEN, he has worked as a materials engineer at multinational companies and the National University of Singapore. His research interests are related to joining technologies using sintered silver for power electronics applications and surface modification using plasma technologies for biomaterials, adhesion and microfluidic applications. His recent review papers on sintered silver are among the top-ranked worldwide. He is a regular reviewer of journal papers for more than 20 international journals. A strong believer in giving back to community, he has served in various capacities organizing conferences such as 36-38th IEMT, ICSE (2014-2016), the 15th-20th EPTC (Singapore), as well as outreach programs at the University of Yangon. He completed his Ph.D. in Engineering (Minerals and Materials) at Ian Wark Research Institute under University of South Australia Presidential Scholarship as well as the Master of Applied Science and Bachelor of Applied Science (Materials Engineering) with Hons. degrees from Nanyang Technological University in 2007, 2000 and 1997 respectively. He is also a certified Project Management Professional, PMP(R), since 2009.