Flexible Electronic Packaging and Encapsulation Technology (Hardcover) (ISBN-13: 9783527353590)

A systematic introduction to the future of electronic packaging

Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential.

Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems.

Flexible Electronic Packaging and Encapsulation Technology readers will also find:

• Survey of commercial electronic packaging materials and patents for reference purposes
• Guidelines for designing high-performance packaging materials with novel structures
• An authorial team of leading researchers in the field

Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

Author: Hong Meng
ISBN-10: 3527353593
ISBN-13: 9783527353590
Publisher: Wiley-Vch
Language: English
Published: 04/12/2024
Pages: 384
Format: Hardcover
Weight: 1.78lbs
Size: 9.61h x 6.69w x 0.88d