Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability by Lee, Tae-Kyu

Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability (Hardcover) (ISBN-13: 9781461492658)

Vendor: Tae-Kyu Lee
Product type: Books
Format: Hardcover
$109.99
$109.99
$109.99
Subtotal: $109.99
Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability by Lee, Tae-Kyu

Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

$109.99
Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability by Lee, Tae-Kyu

Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

$109.99
Format: Hardcover
Description
Description
x

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.



Author: Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim
ISBN-10: 1461492653
ISBN-13: 9781461492658
Publisher: Springer
Language: English
Published: 11/06/2014
Pages: 253
Format: Hardcover
Weight: 1.22lbs
Size: 9.21h x 6.14w x 0.63d

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