High-Bandwidth Memory Interface (Paperback) (ISBN-13: 9783319023809)

This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

Author: Chulwoo Kim, Hyun-Woo Lee, Junyoung Song
ISBN-10: 3319023802
ISBN-13: 9783319023809
Publisher: Springer
Language: English
Published: 11/18/2013
Pages: 88
Format: Paperback
Weight: 0.33lbs
Size: 9.21h x 6.14w x 0.20d