Instant Bonding Epoxy Technology (Paperback) (ISBN-13: 9789815313468)

Instant Bonding Epoxy Technology is a comprehensive guide on the chemistry, formulation, and applications of epoxy adhesive technology, focusing on instant bonding innovations. Authored by a leading expert in polymer science, the book explores the latest advancements across UV, thermal, hybrid, and ambient curing technologies.
Structured into six chapters, it begins with the fundamentals of epoxy resins, curing agents, and adhesive formulations. Subsequent chapters cover UV cure cationic epoxy chemistry, dual cure hybrid systems combining UV and thermal processes, and snap thermal cure adhesives leveraging latent curing agents. Advanced topics include induction cure epoxy technology with laser and weld bonding applications, as well as snap ambient cure systems for room-temperature bonding.


Author: Chunfu Chen
ISBN-10: 9815313460
ISBN-13: 9789815313468
Publisher: Bentham Science Publishers
Language: English
Published: 03/21/2025
Pages: 214
Format: Paperback
Weight: 1.15lbs
Size: 10.00h x 7.00w x 0.56d