Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Hardcover) (ISBN-13: 9781596932463)

Book Information Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects.

Author: Muhannad S. Bakir
ISBN-10: 1596932465
ISBN-13: 9781596932463
Publisher: Artech House Publishers
Language: English
Published: 11/01/2008
Pages: 528
Format: Hardcover
Weight: 2.40lbs
Size: 10.10h x 7.20w x 1.30d

Review Citation(s):
Scitech Book News 03/01/2009 pg. 137