MEMS Packaging Technologies and 3D Integration by Seok, Seonho

MEMS Packaging Technologies and 3D Integration (Hardcover) (ISBN-13: 9783036542584)

Vendor: Seonho Seok
Product type: Books
Format: Hardcover
$72.96
$72.96
$72.96
Subtotal: $72.96
MEMS Packaging Technologies and 3D Integration by Seok, Seonho

MEMS Packaging Technologies and 3D Integration

$72.96
MEMS Packaging Technologies and 3D Integration by Seok, Seonho

MEMS Packaging Technologies and 3D Integration

$72.96
Format: Hardcover
Description
Description
x

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.



Author: Seonho Seok
ISBN-10: 3036542582
ISBN-13: 9783036542584
Publisher: Mdpi AG
Language: English
Published: 06/01/2022
Pages: 210
Format: Hardcover
Weight: 1.44lbs
Size: 9.61h x 6.69w x 0.69d

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