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Mems/Moem Packaging: Concepts, Designs, Materials and Processes (Hardcover) (ISBN-13: 9780071455565)
Vendor:
Ken Gilleo
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Books
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Description
xPublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Author: Ken Gilleo
ISBN-10: 0071455566
ISBN-13: 9780071455565
Publisher: McGraw-Hill Companies
Language: English
Published: 08/01/2005
Pages: 240
Format: Hardcover
Weight: 1.07lbs
Size: 9.12h x 6.32w x 0.85d
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Author: Ken Gilleo
ISBN-10: 0071455566
ISBN-13: 9780071455565
Publisher: McGraw-Hill Companies
Language: English
Published: 08/01/2005
Pages: 240
Format: Hardcover
Weight: 1.07lbs
Size: 9.12h x 6.32w x 0.85d
By Ken Gilleo
xKen Gilleo, Ph.D., is the CEO of ET-Trends, a consulting, packaging design, and IP firm specializing in emerging technologies. The firm's projects include novel materials and packages and processes for MEMS, MOEMS, and optoelectronics. Dr. Gilleo is a member of IEEE and IMAPS, and he is also Vice President of Technical Programs for the Surface Mount Technology Association (SMTA). He has been actively involved in the development of new products for 30 years and is an inventor in circuitry, electronics materials, and packaging. Dr. Gilleo has 30 U.S. patents, and his products have received three R&D 100 Awards. Dr. Gilleo resides in Warwick, Rhode Island.
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