Microelectronic Interconnections and Assembly by Harman, George G.

Microelectronic Interconnections and Assembly (Hardcover) (ISBN-13: 9780792351399)

Vendor: George G. Harman
Product type: Books
Format: Hardcover
$99.00
$99.00
$99.00
Subtotal: $99.00
Microelectronic Interconnections and Assembly by Harman, George G.

Microelectronic Interconnections and Assembly

$99.00
Microelectronic Interconnections and Assembly by Harman, George G.

Microelectronic Interconnections and Assembly

$99.00
Format: Hardcover
Description
Description
x
Preface. 1. Packaging and Interconnection Trends - Present and Future. 2. Solder and Flip Chip Interconnections and Assembly. 3. Single Chip Interconnection and Qualification: Wire Bonding and TAB. 4. Multichip Module Interconnections and Assembly I. 5. Discussion with the Dean and Vice Chancellor of the Czech Technical University and People from the Czech and the Slovak ISHM Chapters. 6. Multichip Module Interconnections and Assembly II. 7. Thick Film Interconnections and Metallurgical Interactions I. 8. Thick Film Interconnections and Metallurgical Interactions II. Subject Index.

Author: George G. Harman,Pavel Mach
ISBN-10: 0792351398
ISBN-13: 9780792351399
Publisher: Kluwer Academic Publishers
Language: English
Published: 08/31/1998
Pages: 316
Format: Hardcover
Weight: 1.36lbs
Size: 9.21h x 6.14w x 0.75d

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