Microwave and Millimeter-Wave Electronic Packaging (Hardcover) (ISBN-13: 9781608076970)

Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs.

Author: Rick Sturdivant
ISBN-10: 1608076970
ISBN-13: 9781608076970
Publisher: Artech House Publishers
Language: English
Published: 03/17/2014
Pages: 261
Format: Hardcover
Weight: 1.25lbs
Size: 9.10h x 6.30w x 0.90d