Mosfet Models for Spice Simulation: Including Bsim3v3 and Bsim4 by Liu, William

Mosfet Models for Spice Simulation: Including Bsim3v3 and Bsim4 (Hardcover) (ISBN-13: 9780471396970)

Vendor: William Liu
Product type: Books
Format: Hardcover
$243.95
$243.95
$243.95
Subtotal: $243.95
Mosfet Models for Spice Simulation: Including Bsim3v3 and Bsim4 by Liu, William

Mosfet Models for Spice Simulation: Including Bsim3v3 and Bsim4

$243.95
Mosfet Models for Spice Simulation: Including Bsim3v3 and Bsim4 by Liu, William

Mosfet Models for Spice Simulation: Including Bsim3v3 and Bsim4

$243.95
Format: Hardcover
Description
Description
x
Beim integrierten Schaltkreisdesign spielt die Schaltkreissimulation eine wesentliche Rolle, wobei deren Genauigkeit von der Genauigkeit des verwendeten Transistormodells abh ngig ist. BSIM3 (BSIM steht f r Berkley Short-channel IGFET Model) wurde als erstes MOSFET Modell zur Standardisierung ausgew hlt. Es wird erwartet, da in den kommenden Jahren viele Halbleiterunternehmen zu BSIM3 wechseln.
Dieses Buch erl utert die technischen Einzelheiten von BSIM 3, warum sich die meisten Unternehmen f r dieses Modell entscheiden und wo es eingesetzt werden kann. Eines der f nf Kapitel widmet sich BSIM4, dem Nachfolgemodell von BSIM3.

Author: William Liu
ISBN-10: 0471396974
ISBN-13: 9780471396970
Publisher: Wiley-IEEE Press
Language: English
Published: 02/21/2001
Pages: 600
Format: Hardcover
Weight: 2.19lbs
Size: 9.63h x 6.33w x 1.59d
By William Liu
By William Liu
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WILLIAM LIU, PhD, is a senior member of the technical staff at Texas Instruments, where he has worked since obtaining his PhD in electrical engineering from Stanford University in 1991. Dr. Liu has been TI's lead contact in mentoring the development of BSIM4 model equations with UC Berkeley, and has been in charge of the modeling development for LDMOS/DEMOS and RF-CMOS in TI's SPICE Modeling Laboratory. Dr. Liu has authored/coauthored five book chapters, and has written more than fifty journal papers on modeling, device characterization, and fabrication. Dr. Liu has also published two books on III-V device technologies. Dr. Liu holds sixteen U.S. patents and is a senior member of IEEE.

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