Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan by Otsuka, K.

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan (Hardcover) (ISBN-13: 9781851665792)

Vendor: K. Otsuka
Product type: Books
Format: Hardcover
$329.99
$329.99
$329.99
Subtotal: $329.99
Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan by Otsuka, K.

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan

$329.99
Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan by Otsuka, K.

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan

$329.99
Format: Hardcover
Description
Description
x
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.

Author: K. Otsuka
ISBN-10: 185166579X
ISBN-13: 9781851665792
Publisher: Springer
Language: English
Published: 04/30/1993
Pages: 242
Format: Hardcover
Weight: 1.19lbs
Size: 9.21h x 6.14w x 0.63d

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