Polymeric Materials for Electronic Packaging (Hardcover) (ISBN-13: 9781394188796)

Create and deploy reliable polymeric materials for use in electronic products with this comprehensive guide

Modern electronic products are manufactured at a finer scale and with more precision than ever before. This places increasing demand on the proper use and management of high-performance polymers to create reliable, rapidly-operating semiconductor products. Understanding the physical properties and viscoelasticity analysis of resins is essential for engineers and researchers to perfect and deploy these polymers in electronics contexts.

Polymeric Materials for Electronic Packaging is designed to meet this specific need with a thorough introduction to these materials and their production. It provides the tools engineers need to reduce processing times and increase durability in their semiconductor packages and products. Translated from the Japanese original and offering in-depth analysis from a global-leading expert, this promises to be an indispensable volume.

Polymeric Materials for Electronic Packaging readers will also find:

• Detailed treatment of subjects including viscoelastic theory, design issues of LSI packages, and more
• Analysis uniquely suited to the dimensions of cutting-edge semiconductor technology
• Incorporation of cutting-edge viscoelasticity analysis software, available separately from the author

Polymeric Materials for Electronic Packaging is critical for electrical and electronics engineers working with semiconductors, as well as advanced postgraduate students and researchers in this or numerous related areas.

Author: Shozo Nakamura
ISBN-10: 139418879X
ISBN-13: 9781394188796
Publisher: Wiley-IEEE Press
Language: English
Published: 09/20/2023
Pages: 208
Format: Hardcover
Weight: 0.98lbs
Size: 9.00h x 6.00w x 0.50d