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Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides a basic understanding of electronics packaging design issues, updated to reflect recent developments in the field. Early chapters provide a foundation in heat transfer, vibration, and life expectancy calculations.
Author: Ali Jamnia
ISBN-10: 1032097825
ISBN-13: 9781032097824
Publisher: CRC Press
Language: English
Published: 06/30/2021
Pages: 374
Format: Paperback
Weight: 1.16lbs
Size: 9.21h x 6.14w x 0.78d
Ali Jamnia enjoys teaching and mentoring junior engineers. His primary expertise lies in electromechanical systems design and development. In addition, he enjoys conducting analysis of various engineering problems using numerical approximations and computer simulations. Dr. Jamnia has focused on the issues of electronics packaging since the early 1990s, and since 1995, has been involved with the development of innovative electronics systems to aid individuals with either physical or cognitive disabilities. In fact, his prime achievement has been the development of a specialized computer system called the Learning StationTM - used as a teaching tool for individuals with cognitive disabilities.
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