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Cutting-edge information about materials, technologies, and mechanisms of printed electronics, and their applications for the smart packaging
Printed Electronics for Smart Packaging describes how and why to use printed electronic devices for application in smart packaging.
Written by two highly qualified academics, Printed Electronics for Smart Packaging covers sample topics such as:
A must-have resource for anyone to expand the knowledge of the latest developments for intelligent packaging, Printed Electronics for Smart Packaging is an essential read for not just related academics but also various intersecting industries and professionals due to the importance of packaging in all market sectors.
Author: Wei Wu
ISBN-10: 3527351167
ISBN-13: 9783527351169
Publisher: Wiley-Vch
Language: English
Published: 12/15/2025
Pages: 320
Format: Hardcover
Weight: 1.57lbs
Size: 9.61h x 6.69w x 0.75d
Wei Wu is full professor and Head of Laboratory of Printable Functional Materials and Printed Electronics, Dean of School of Printing and Packaging, Wuhan University. He received the 15th Bi Shen Award of Printing Technology in 2019, STAM Best Paper Award in 2017 and Hong Kong Scholars Award in 2014.
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