Rapid Thermal Processing for Future Semiconductor Devices (Paperback) (ISBN-13: 9780444513397)

This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.

This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.


Author: H. Fukuda,Fukuda
ISBN-10: 0444513396
ISBN-13: 9780444513397
Publisher: Elsevier Bv
Language: English
Published: 04/02/2003
Pages: 160
Format: Paperback
Weight: 0.53lbs
Size: 9.21h x 6.14w x 0.35d