Semiconductor Wafer Bonding: Science and Technology by Tong, Q. -Y

Semiconductor Wafer Bonding: Science and Technology (Hardcover) (ISBN-13: 9780471574811)

Vendor: Q. -Y Tong
Product type: Books
Format: Hardcover
$199.95
$199.95
$199.95
Subtotal: $199.95
Semiconductor Wafer Bonding: Science and Technology by Tong, Q. -Y

Semiconductor Wafer Bonding: Science and Technology

$199.95
Semiconductor Wafer Bonding: Science and Technology by Tong, Q. -Y

Semiconductor Wafer Bonding: Science and Technology

$199.95
Format: Hardcover
Description
Description
x
Bonding - eine Technik zum "Verschwei en" von Halbleiter-Wafers ohne "Klebstoff" - wird in der Mikroelektronik, Energieelektronik, Mikromechanik, Optoelektronik und anderen Bereichen verbreitet eingesetzt. Dieser Band sammelt und systematisiert die in der Literatur verstreuten Informationen zum Wafer-Bonding; es finden sich beispielsweise Kapitel zum Bonding bei Raumtemperatur, zur W舐mebehandlung, zum Bonding ungleicher Materialien und strukturierter Wafers. (01/99)

Author: Q. -Y Tong, U. Gele
ISBN-10: 0471574813
ISBN-13: 9780471574811
Publisher: Wiley-Interscience
Language: English
Published: 12/07/1998
Pages: 320
Format: Hardcover
Weight: 1.25lbs
Size: 9.60h x 5.98w x 0.78d
By Q. -Y Tong
By Q. -Y Tong
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Q.-Y. TONG is Professor and Director of the Microelectronics Center at Southeast University in Nanjing, China, and Adjunct Professor at Duke University's School of Engineering. Currently, he is also the manager of the Wafer Bonding Lab at the Research Triangle Institute. He was formerly a consultant at the Max-Planck-Institute of Microstructure Physics.

U. GﾖSELE, PhD, is Director at the Max-Planck-Institute of Microstructure Physics in Halle, Germany, and J.B. Duke Professor of Materials Science at Duke University's School of Engineering in Durham, North Carolina.

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