System on Package: Miniaturization of the Entire System by Tummala, Rao

System on Package: Miniaturization of the Entire System (Hardcover) (ISBN-13: 9780071459068)

Vendor: Rao Tummala
Product type: Books
Format: Hardcover
$154.00
$154.00
$154.00
Subtotal: $154.00
System on Package: Miniaturization of the Entire System by Tummala, Rao

System on Package: Miniaturization of the Entire System

$154.00
System on Package: Miniaturization of the Entire System by Tummala, Rao

System on Package: Miniaturization of the Entire System

$154.00
Format: Hardcover
Description
Description
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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.




System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

Author: Rao Tummala
ISBN-10: 0071459065
ISBN-13: 9780071459068
Publisher: McGraw-Hill Companies
Language: English
Published: 04/01/2007
Pages: 785
Format: Hardcover
Weight: 3.08lbs
Size: 9.30h x 7.60w x 1.40d
By Rao Tummala
By Rao Tummala
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Dr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICTC. He was recently named by Industry Week as one of the 50 Stars in the US for improving national competitiveness.

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