Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments by Cepeda-Rizo, Juan

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Hardcover) (ISBN-13: 9781032160818)

Product type: Books
Format: Hardcover
$130.00
$130.00
$130.00
Subtotal: $130.00
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments by Cepeda-Rizo, Juan

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

$130.00

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

$130.00
Format: Hardcover

Recently Viewed Products