Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments by Cepeda-Rizo, Juan

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Paperback) (ISBN-13: 9781032160856)

Product type: Books
Format: Paperback
$61.99
$61.99
$61.99
Subtotal: $61.99
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments by Cepeda-Rizo, Juan

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

$61.99

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

$61.99
Format: Paperback

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